On-chip antenna-integrated 300 GHz-band 2D phased-array transceiver IC developed

We have succeeded in realizing a two-dimensional phased-array transceiver capable of wireless communication in the terahertz band, implemented entirely in a CMOS integrated circuit — including the antennas and the bi-directional transmit/receive circuitry.

This achievement was presented at the 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits, held in Honolulu, USA, from June 14 to 18.

Key points

• Realized a 300 GHz-band 2D phased-array transceiver using a low-cost, mass-producible CMOS integrated circuit
• Achieved the world’s first integration of a 300 GHz half-wavelength-spaced 2D 4×4 antenna array together with bi-directional phased-array transmit/receive circuitry on a single all-CMOS chip
• Demonstrated an ultra-low-power, low-cost IC, accelerating the implementation of terahertz-band wireless communication in 6G

Publication

Chun Wang, Olivia Angel Yong, Chenxin Liu, Wenqian Wang, Anyi Tian, Abanob Shehata, Takumi Kojima, Hans Herdian, Yudai Yamazaki, Sunghwan Park, Minzhe Tang, Dongfan Xu, Sena Kato, Yuncheng Zhang, Kazuaki Kunihiro, Hiroyuki Sakai, and Kenichi Okada, “A 240-270 GHz 4x4 Bi-Directional Phased-Array Transceiver with On-Chip Half-Wavelength-Spaced Array and Ultra-Low Power Consumption in 65-nm CMOS,” IEEE Symposium on VLSI Technology and Circuits (VLSI Circuits), Honolulu, HI, June 2026.